Core Capabilities
Nanomaterials Synthesis.
We specialize in producing nanomaterials with morphological features smaller than 100 nanometers in at least one dimension. Our advanced high-energy and cryogenic ball milling processes, also known as mechanical attrition or mechanical alloying, enable the synthesis of a wide variety of nanostructured powders. By inducing heavy cyclic deformation, these methods decompose coarse-grained structures to form nanostructures. Cryogenic milling (cryo-milling) further minimizes oxidation and thermal buildup, promoting fracturing over welding in ductile materials. These nanomaterials serve as critical constituents for protective coatings, high-strength composites, brazing alloys, magnetic devices, thermoelectric devices, and energy devices. We have carried out the development and the associated manufacturing of (1) metallic and ceramic thin film (nanocoating) for RF applications, (2) RF nanocomposites.
Sintering and Consolidation.
Aegis Materials offers advanced sintering and consolidation services for bulk nanostructured materials. Our capabilities extend to high-strength composites, magnetic and thermoelectric materials, thermal management solutions, ceramic capacitor materials, and battery materials. One example is Nanostructured Metal Matrix Composites (NMMCs) feature a unique nanocrystalline microstructure. These materials deliver tensile strength up to 1000 MPa, comparable to rolled steel and titanium alloys, while maintaining significantly lower density: aluminum-based NMMCs have just 33% the density of steel and 60% that of titanium alloys.
High-Temperature Packaging & Thermal Management
Aegis employs advanced process techniques to support high-temperature packages and thermal management. Aegis Materials is a leader in thermal management for SiC power electronics, combining innovative materials with engineered designs to enable high power density and high-temperature operation. Our solutions include high efficiency heatsinks and heat exchangers utilizing microchannels, microjet cooling, porous materials, and phase change materials. We also develop high-temperature aluminum nitride (AlN) packaging capable of operating up to 600°C, alongside high-thermal-conductivity ceramic substrates (metallized AlN and Si₃N₄) and Cu- or Al-based metal matrix composites. These thermal management technologies support a wide range of mission-critical applications, including armored and Army vehicle propulsion systems, high-power laser systems, microwave amplifiers, and radar systems. Our capabilities include:
- Advanced Joining: Ceramic-to-metal, carbon-to-ceramic, and carbon-to-metal brazing and sealing, as well as high-temperature interconnections and soldering.
- Substrate Metallization & Assembly: Metallization on AlN and Si₃N₄ substrates, supported by wire bonding for reliable, high-performance electronic assemblies.
- Specialized Facilities: Our facilities are equipped with air, vacuum, and controlled-atmosphere furnaces, hot isostatic pressing (HIP), degassing systems, attritor and screen-printing systems, gloveboxes, and a dedicated power electronics testing laboratory.
- Characterization & Design: Comprehensive thermal, mechanical, and electrical characterization tools, complemented by FEA and AutoCAD software for robust design and analysis.
3-D Printing
We have carried out the development and the associated manufacturing of 3-D printing for various components and applications. Over years our efforts also include the projects using 3D printing technology such as cost-effective, scalable 3D printed phased arrays and additive manufacturing (3-D Printing) of affordable solid oxide fuel cell (SOFC) and solid-state Li-ion batteries.